3dic fnal.gov

3DIC at Fermilab

Consortium for Development of Vertically Integrated 3D Readout Electronics and Sensors. Vertical integration or 3D for short is defined as the integration of thinned and bonded silicon integrated circuits with vertical interconnects between IC layers. Handbook of 3D Integration. Edited by Philip Garrou, Christopher Bower, and Peter Ramm, Wiley-VCH, 2008.
traffic

OVERVIEW

This web page 3dic.fnal.gov presently has a traffic ranking of zero (the lower the superior). We have evaluated seven pages inside the web site 3dic.fnal.gov and found eight websites referring to 3dic.fnal.gov.
Pages Analyzed
7
Links to this site
8

3DIC.FNAL.GOV RANKINGS

This web page 3dic.fnal.gov is seeing a alternation levels of traffic all over the year.
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LINKS TO BUSINESS

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WHAT DOES 3DIC.FNAL.GOV LOOK LIKE?

Desktop Screenshot of 3dic.fnal.gov Mobile Screenshot of 3dic.fnal.gov Tablet Screenshot of 3dic.fnal.gov

3DIC.FNAL.GOV HOST

Our web crawlers found that the main page on 3dic.fnal.gov took five thousand and fifty-two milliseconds to come up. We could not find a SSL certificate, so therefore I consider this site not secure.
Load time
5.052 seconds
SSL
NOT SECURE
Internet Address
131.225.105.240

SERVER OPERATING SYSTEM AND ENCODING

I caught that 3dic.fnal.gov is weilding the Apache/2.2 server.

TITLE

3DIC at Fermilab

DESCRIPTION

Consortium for Development of Vertically Integrated 3D Readout Electronics and Sensors. Vertical integration or 3D for short is defined as the integration of thinned and bonded silicon integrated circuits with vertical interconnects between IC layers. Handbook of 3D Integration. Edited by Philip Garrou, Christopher Bower, and Peter Ramm, Wiley-VCH, 2008.

CONTENT

This web page states the following, "Consortium for Development of Vertically Integrated 3D Readout Electronics and Sensors." Our analyzers saw that the web site said " Vertical integration or 3D for short is defined as the integration of thinned and bonded silicon integrated circuits with vertical interconnects between IC layers." The Website also said " Edited by Philip Garrou, Christopher Bower, and Peter Ramm, Wiley-VCH, 2008."

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